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Pal-GHK-Copper


Pal-GHK-Copper

Catalog:CDLC24-003-L

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INQUIRY Datasheet

Structure Pal-GHK-Copper
Purity>95 %
Molecular FormulaC16H25CuN6O6
CAS No.300801-03-0
DescriptionGHK-Cu is a complex of the tripeptide Gly-His-Lys and a copper(II) ion that has wound healing and anti-inflammatory activities. GHK-Cu increases levels of collagen and glycosaminoglycans (GAGs) and the expression of decorin in the wound tissue of rats. It decreases LPS-induced increases in the levels of reactive oxygen species (ROS) and IL-6.
Formula Weight460.96 g/mol
Technology ApplicationsApplied to anti-inflammatory and restorative products.
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