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SIFSIX-1-Cu


SIFSIX-1-Cu

Catalog:CDM-CH028

INQUIRY Datasheet

SIFSIX-1-Cu-CDM-CH028
SynonymCu-HHB
Common UseElectrode materials
Structure SIFSIX-1-Cu
StorageStore at room temperature or 4 °C in dry-state. Recommend to be activated at 80 ℃ in a vacuum oven for 12 hours before use
Molecular Weight517.99
Molecular FormulaC20H16CuF6N4Si
CAS No.288297-89-2
AppearanceWhite Powder
Size50-200 nm
Pore Volume0.43 cm³/g
Pore Size1.1 nm
Specific Surface130 m²/g (by BET)
StabilityThermal stability: 240°C; Stable in air and in water.
MetalCu
LigandTetrahydroxyquinone (CAS: 319-89-1)
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